Flexible nozzle for injection molded solder

ABSTRACT

A flexible nozzle for injection molded solder and a method of utilizing a flexible nozzle for injection molded solder applications. In order to be able to efficiently carry out the injection molded soldering process, there is utilized a compliant or flexible solder-dispensing nozzle structure, which is particularly advantageously adapted to be utilized with circular or round molds. In this connection, the tip of the nozzle, which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir. In one embodiment, there may be employed a single solder reservoir with which there communicates a plurality of discharge apertures or holes for extruding the solder so as to fill suitable cavities or recesses formed in a facing surface of a mold for injection molded solder. Alternatively, rather than dispensing or extruding the solder from a single reservoir through a plurality of holes or discharge apertures, each respective aperture or a group of apertures may be connected to, respectively, a separate solder reservoir of a plurality of reservoirs subjected to pressure to facilitate the solder extrusion onto the mold surface.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to the provision of a flexible nozzle for injection molded solder. Moreover, the invention is also directed to a method of utilizing a flexible nozzle for injection molded solder applications.

In the utilization of round or essentially circularly-configured molds, which are employed for injection molded solder (IMS) applications, difficulties may be encountered due to some amounts of solder having a tendency to leak over the edges of the molds, in contrast with either square or rectangular molds in which those solder leaking problems are not as prevalent, or are only infrequent in nature.

In order to be able to efficiently employ round or essentially circular molds in injection molded solder processing, it has been ascertained that a flexible or compliant solder extending or dispensing nozzle enables molten solder to readily be discharged therefrom while traversing the surface of the mold, however, the flexible nozzle which dispenses the solder can change shape in order to be able to accommodate its location on the mold even if the latter is not square or rectangular in configuration. This facilitates the flexible nozzle to be utilized in connection with silicon, or alternatively round molds.

SUMMARY OF THE INVENTION

In order to be able to efficiently carry out the injection molded soldering process, pursuant to the invention there is utilized a compliant or flexible solder-dispensing nozzle structure, which is particularly advantageously adapted to be utilized with circular or round molds. In this connection, the tip of the nozzle, which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir. In one embodiment, there may be employed a single solder reservoir with which there communicates a plurality of discharge apertures or holes for extruding the solder so as to fill suitable cavities or recesses formed in a facing surface of a mold for injection molded solder. Alternatively, rather than dispensing or extruding the solder from a single reservoir through a plurality of holes or discharge apertures, each respective aperture or a group of apertures may be connected to, respectively, a separate solder reservoir of a plurality of reservoirs subjected to pressure to facilitate the solder extrusion onto the mold surface.

Accordingly, it is an object of the present invention to provide a novel flexible nozzle structure for dispensing solder under pressure from a single solder reservoir in order to fill cavities or recesses formed in a mold.

Pursuant to a further object of the invention, rather than providing a single reservoir, the discharge apertures of the flexible nozzle may be connected to, respectively, separate supply reservoirs for the solder.

A still further object of the present invention is to provide for a method of utilizing the flexible nozzle structures to implement the injection molded soldering process.

BRIEF DESCRIPTION OF THE DRAWINGS

Reference may now be made to the following detailed description of preferred embodiments of the invention, taken in conjunction with the accompanying drawings; in which:

FIG. 1 illustrate a first embodiment of a flexible nozzle structure utilizing a single solder reservoir connected to a plurality of discharge orifices for extruding solder under pressure; and

FIG. 2 illustrates a second embodiment of a flexible nozzle, which is similar to the embodiment of FIG. 1, which, in this instance, has the discharge orifices thereof connected to, respectively, separate solder reservoirs of a plurality of reservoirs. In one example, the reservoirs may be made of a series of vertical tubes which each may hold molten solder during the injection process whereas the relative position of the tubes to each other and to the mold can be altered through the housing or guide plates so as to have the nozzle conform to the shape of mold as the mold or nozzle are moved relative to one another. In this example, the nozzle may take the form of a curved surface initially convex as it begins at one edge of the mold, conform to a linear shape during movement relative to the mold and end as a concave shape relative to the far side of the mold with fill completion.

DETAILED DESCRIPTION OF THE INVENTION

Referring specifically to the drawings, and in particular to FIG. 1, there is illustrated a mold 10 including a surface 12 containing a plurality of cavities or recesses 14 adapted to be filled with a suitable solder 16 by means of an injection molded soldering (IMS) process. The mold 10 is preferably, but not necessarily of a round or essentially circularly-configured shape in the peripheral dimensions. Movable relative to the surface 12 of the mold 10 in close spacing or contact with the surface thereof containing the cavities or recesses 14 is a flexible or compliable nozzle structure 20, which, in this embodiment has a housing 22 containing a single reservoir 24 adapted to be filled with solder 16 under pressure. The tip end 26 of the housing 22 facing the mold surface 12 is provided with a plurality of apertures 28 communicating with the reservoir 24 for dispensing or extruding the solder under pressure into the cavities or recesses in the mold surface during relative displacement of the nozzle therewith.

In the embodiment of FIG. 2 of the drawings, wherein the components which are similar to or identical with those in the embodiments of FIG. 1, are designated with the same reference numerals, in this instance, rather than the housing 22 for the flexible nozzle containing a single reservoir of solder under pressure, there are arranged therein a plurality of separate solder reservoirs 30, each being respectively connected to at least one separate solder dispensing aperture 32 at the tip end of the flexible nozzle in contact with or facing the surface of the mold 10, so as to be able to fill the cavities or recesses in the mold during relative motion with respect to the nozzle.

From the foregoing, it becomes readily apparent to one of skill in the technology that through the use of a flexible or compliant nozzle, which is adapted to move relative to the surface of a mold containing cavities or recesses which are adapted to be filled with the solder which is extruded from apertures of the flexible nozzle, this facilitates the filling of the cavities, in round or essentially circular molds, without encountering the difficulties or problems of solder spilling or leaking about the peripheral edges of the mold.

While the present invention has been particularly shown and described with respect to preferred embodiments thereof, it will be understood by those skilled in the art that the foregoing and other changes in forms and details may be made without departing from the spirit and scope of the present invention. It is therefore intended that the present invention not be limited to the exact forms and details described and illustrated, but to fall within the spirit and scope of the appended claims. 

1. An arrangement for injection molded solder applications, wherein said arrangement comprises: a mold having a surface possessing a plurality of recesses; and a flexible nozzle for extruding solder under pressure into said plurality of recesses during relative movement between said mold and the flexible nozzle upon displacement of the nozzle along the surface of said mold.
 2. An arrangement as claimed in claim 1, wherein said flexible nozzle includes a housing having a single reservoir containing said solder; and a plurality of solder discharge apertures in said housing facing said mold surface and communicating with said single reservoir for extruding said solder into said recesses in the mold surface during said relative movement between the components.
 3. An arrangement as claimed in claim 1, wherein said flexible nozzle includes a housing having a plurality of separate reservoirs, each containing a quantity of said solder; and a plurality of solder discharge apertures in said housing facing said mold surface of which at least one said aperture communicates with, respectively, one of said reservoirs for extruding the quantities of solder contained therein into said recesses in the mold surface during said relative movement between the components.
 4. An arrangement as claimed in claim 1, wherein said mold is of an essentially round or circular configuration, and said mold surface possessing said recesses being substantially planar.
 5. A method of implementing injection molded solder applications, wherein said method comprises: providing a mold having a surface possessing a plurality of recesses; and having a flexible nozzle for extruding solder under pressure into said plurality of recesses during relative movement between said mold and the flexible nozzle upon displacement of the nozzle, as said nozzle is displaced along the surface of said mold.
 6. A method as claimed in claim 5, wherein said flexible nozzle includes a housing having a single reservoir containing said solder; and a plurality of solder discharge apertures in said housing facing said mold surface communicate with said single reservoir for extruding said solder into said recesses in the mold surface during said relative movement between said components.
 7. A method as claimed in claim 5, wherein said flexible nozzle includes a housing having a plurality of separate reservoirs, each containing a quantity of said solder; and a plurality of solder discharge apertures in said housing facing said mold surface of which at least one said aperture communicates with, respectively, one of said reservoirs for extruding the quantities of solder contained therein into said recesses in the mold surface during said relative movement between the components.
 8. A method as claimed in claim 5, wherein said mold is of an essentially round or circular configuration, and said mold surface possessing said recesses being substantially planar.
 9. A method as claimed in claim 5, wherein said mold is of an essentially round, circular, square or rectangular configuration and said mold surface is non-planar and said flexible nozzle can conform the non-planar mold surface such as a curved mold surface or stepped mold surface.
 10. A nozzle wherein the design, materials and structure may be comprised using a high temperature polymer or rubber, a metal coating on a polymer or rubber, a combination of metal, polymer, and/or inorganic material including: one or more reservoirs for solder; one or more dispensing apertures; and a housing, guide plate or external force to cause the flexible nozzle to alter its shape relative to its position with respect to the mold. 